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Diamond and CBN
grinding wheels
Diamond dressing
tools
Diamond rotary
dressers
Electroplated diamond
and CBN tools
Hardness tester diamond
Polishing and lapping with diamonds
Diamonds for turning and milling
Polycrystalline diamond and CBN cutting tools
Anti-abrasion layers


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ABRASIVE LAYER FOR DIAMOND AND CBN GRINDING WHEELS
 
 
 

For cup and dish grinding wheels, the width of the abrasive layer influences the grinding behavior and the efficiency of the grinding tool considerably via contact surface "A". The contact surfaces must be kept as small as possible here, i.e. the width of the abrasive layer must be minimized. Under no circumstances should the abrasive layer width "W" exceed the immersion depth on the workpiece, "h".


The advantages of small abrasive layer widths are:

- Higher stock removal rate
- Reduced grinding heat
- Enhanced chip removal

It is advisable to use larger abrasive layer widths for off-hand grinding, since they ensure improved workpiece guidance. This reduces the risk of the workpiece getting jammed, and thus being damaged. The required higher pressing force can be kept within the permissible limits by reducing the concentration.

The thickness of the abrasive layer indicates its dimension in the feed direction of the grinding tool.

Although the thickness of the abrasive layer has almost no influence on technical abrasive properties, it is very important for grinding costs. A thicker abrasive layer is more economical simply because it does not influence the manufacturing costs of the grinding tool. A grinding tool with twice the abrasive layer thickness thus costs considerably less than twice as much.

 
     


Diamond and CBN
grinding wheels


Riegger Bonds
  - Resin Bonds
  - Metal Bonds
  - Ceramic Bonds
Overview of shapes
Example of ordering data
Applications parameters
rpm table
Formula generator


Fundamentals


Design of grinding wheel
Dimensions of grinding wheel
Shape of grinding wheel
Abrasive layer
Abrasive grains
concentration
Bonds

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